METHOD FOR ENGRAVING, MARKING AND/OR INSCRIBING A WORKPIECE USING A LASER PLOTTER, AND LASER PLOTTER HEREFOR

摘要

The invention describes a method for engraving, marking and/or inscribing a workpiece (7) using a laser plotter (2). In said method, in a housing (3) of the laser plotter (2), one, preferably more, in particular two laser sources (4) in the form of lasers (5, 6) have an effect preferably alternating on the workpiece (7) to be processed. The workpiece (7) is laid in a defined manner on a processing table (9) and a laser beam (10) emitted from the beam source (4) is transmitted to at least one focusing unit (12) via deflection elements (11) and the laser beam (10) is diverted toward the workpiece (7) and focused for processing. The workpiece (7), in particular the position of the work piece in relation to the laser beam (1), is controlled by means of software running in a control unit (13), such that the workpiece (7) is processed line by line by the displacement of a carriage (21). A sequence control adapted to the quality of the engraving in which a defined ratio of a spot variable (23) to the line distance and an engraving controller (1) of the lines (22) to be processed is determined and/or carried out by the control unit (13) and the focusing unit (12) on the carriage (21) is controlled corresponding to the defined parameters of the sequence control.