Cure Cycle Evaluation for Multilayer Printed Wiring Boards

摘要

The cure cycle for multilayer printed wiring boards (PWBs) made from general-puspore, fire-retardant epoxy/glass (GF) material has been evaluated for the optimum delamination resistance at soldering temperatures. The results that, for the epoxy resin system used to manufacture multilayer PWBs at Bendix Kansas City, a wide range of cure cycle variations has a minimal effect on delamination resistance. (ERA citation 05:034050)