Analyses of Some Problems Occurring in Electronic Assembly Packaging

摘要

A compilation of five working papers on electronic assembly packaging problems is presented. The topics discussed are: analysis of stresses in electronic component leads, an estimate of temperature response in an electronic component due to a soldering operation, analysis of stress in an electronic component and solder joint due to encapsulation, effective thickness of a conformal coating on an electronic component, uniaxial compression testing as a means of determining bulk modulus of a syntactic elastomer. Uniaxial compression testing of thin samples to determine the material bulk modulus is reviewed. Elasticity equations applie an expression for the bulk modulus in terms of the applied uniaxial stress, the observed strain, and Poisson's ratio. For special cases in which Poisson's ratio approaches 1/2, the bulk modulus is determined to be very nearly equal to the ratio of the applied stress to the observed strain. (ERA citation 07:004961)