Plating on Molybdenum

摘要

A new method of obtaining adherence of copper coatings on molybdenum is described. The process involves magnetron ion plating followed by copper electroplating in aqueous solution. Quantitative adhesion data are presented for this process and for a number of other procedures previously recommended in the literature. With the magnetron ion plating process, which does not require the severe chemical etching or hydrogen firing steps of other processes, parts as large as 1.3 m (diameter) were successfully coated. (ERA citation 12:031112)