Application of non-cyanide gold for selective plating of microelectronic circuits.

摘要

With the current trends towards miniaturization, high performance, high quality and cost competiveness, the electrodeposition process has become an important manufacturing technology in many new microelectronic applications. Gold electrodeposition plays an increasing role in processes that require this noble metal. Added to these trends is the continuing and increasing emphasis on manufacturing processes which are less damaging to the environment and potentially less hazardous to the operator and personnel in the vicinity of the operation. The present standard gold plating solutions are based on cyanide salts and are considered acutely hazardous solutions. The trend away from their use is gaining momentum as new non-hazardous gold plating solutions and manufacturing processes making use of them are developed. 2 refs.