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Microelectromechanical Systems (MEMS)-Based Microcapillary Pumped Loop for Chip-Level Temperature Control.

机译:基于微机电系统(mEms)的微毛细管泵浦回路用于芯片级温度控制。

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摘要

Utilizing current microelectromechanical systems (MEMS) technologies, a three-port microcapillary pumped loop (micro-CPL) was designed, fabricated, and tested to provide integral cooling to electronics of MEMS-type devices. The two-wafer design consists of one silicon and one borofloat glass wafer. An analytical study, adopted from traditional CLP theory, was used in determining the geometry of the device, including the evaporator dimensions (1000 by 2000 micrometers) and the length of the liquid and vapor lines (35 mm). Using laser spot heating, the finished device was run near steady state. The micro-CPL resulted in a backside cooling effect of a least 7 K when a laser delivering 7.5 W (+/- 0.2 W) with a spot-Size diameter of 1.0 mm was focused on the front side of the evaporator region.

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