首页> 美国政府科技报告 >Proceedings of the International Electronic Circuit Packing Symposium (2 nd) on Advances in Electronic Circuit Packaging. Volume 2.

【24h】

Proceedings of the International Electronic Circuit Packing Symposium (2 nd) on Advances in Electronic Circuit Packaging. Volume 2.

机译：关于电子线路封装进展的国际电子线路包装研讨会（第二期）会议记录。第2卷。

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

No abstract available.

著录项

作者
Walker, G. A.;
展开▼
作者单位

展开▼
年度 1962
页码 1-342
总页数 342
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Microelectronics; Packaging; Miniature electronic equipment; Avionics; Meetings; Submarine equipment; Acceleration; Modular construction; Semiconductors; Circuit interconnections; Lightweight; Encapsulation; Electrical networks; Heat sinks; Printed circuit boards; Solid state electronics; Telemeter systems; Packaged circuits; Ballistic missile submarines;

机译：微电子;封装;微型电子设备;航空电子设备;会议;潜艇设备;加速;模块化结构;半导体;电路互连;轻量级;封装;电气网络;散热片;印刷电路板;固态电子设备;遥测系统;封装电路;弹道导弹导弹潜艇;

相似文献

外文文献
中文文献
专利

1. A probabilistic power estimation method for combinational circuits under real gate delay model (Reprinted from Proceedings of 1999 IEEE International Symposium on Circuits and Systems (ICAS), May 30-June 2, 1999, Orlando, Floria, USA, vol 1, pg 286-2 [J] . Theodoridis G., Soudris D., Goutis C., VLSI Design . 2001,第1期

机译：实际门延迟模型下组合电路的概率功率估计方法（转载自1999年IEEE国际电路与系统专题讨论会（ICAS）会议录，1999年5月30日至6月2日，美国奥兰多，弗洛里亚，第1卷，第286页） 2
2. Foreword to the special issue on 20th IEEE international symposium on design and diagnostics of electronic circuits and systems (DDECS2017) [J] . Stamenkovic Zoran, Novak Ondrej, Pleskacz Witold Microelectronics & Reliability . 2018,第FEBa期

机译：第20届IEEE电子电路和系统的设计和诊断国际研讨会（DDECS2017）上的特刊的序言
3. Special Issue on the 19th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2016) Foreword [J] . Steininger Andreas, Pawlak Adam, Stopjakova Viera Journal of circuits, systems and computers . 2017,第8期

机译：第19届IEEE电子电路和系统设计与诊断国际研讨会（DDECS 2016）前言
4. International Symposium on Design and Diagnostics of Electronic Circuits and Systems [C] . Zoran Stamenkovic, Alberto Bosio, Gyorgy Cserey, International Test Conference . 2019

机译：电子电路与系统设计与诊断国际研讨会
5. Advances in Materials Strategies, Circuit Designs, and Informatics for Wearable, Flexible and Stretchable Electronics with Medical and Robotic Applications [D] . Liu, Yu Hao. 2016

机译：具有医疗和机器人应用的材料策略，电路设计和信息学的研究进展
6. The International Society for Developmental Psychobiology Sackler Symposium: Early adversity and the maturation of emotion circuits - a cross-species analysis [O] . Bridget L. Callaghan, Regina M Sullivan, Brittany Howell, -1

机译：国际发展心理生物学协会萨克勒研讨会：早期逆境与情感循环的成熟-跨物种分析
7. Simulation Techniques for Electronics Packaging. 2. Electrical Design. Impedance Analysis for Power Distribution Planes in Multilayer Printed Circuit Boards. [O] . Sadahiro TANI, Isao SHIRAKAWA 2001

机译：电子包装仿真技术。 2.电气设计。多层印刷电路板配电平面阻抗分析。

Proceedings of the International Electronic Circuit Packing Symposium (2 nd) on Advances in Electronic Circuit Packaging. Volume 2.

摘要

著录项

相似文献

相关主题

期刊订阅