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Simulation in Infrared Imaging: Using Electrical Circuit Principles to Model Heat Transfer.

机译:红外成像仿真:利用电路原理模拟传热。

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Simulation of thermal or infrared imaging involves modeling the heat exchange between database features and external sources of heat or radiation (e.g., the sun). One approach to computing differential scene irradiance, as viewed by a sensor, employs electrical circuit theory to model heat transfer between the database objects within the scene. In this report, practical shortcomings of this circuit approach and possible alternatives are introduced and analyzed. Heat storage (capacitance) was one process simulated. Results showed that the computational changes required to implement thermal capacitance are difficult to simulate numerically. Individual feature estimates of capacity were inconsistent with expectations. In addition, the temperature contribution from the capacity or time-varying component did not overcome the effect of the steady-state component, which contained a significant amount of error from assumptions made in the circuit model. Further work is required to identify approaches which provide less extreme object temperatures throughout a diurnal or daily cycle.

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