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Low-load deformation of InP under contact loading; comparison with GaAs

机译:InP在接触载荷下的低载荷变形;与砷化镓比较

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Nanoindentation has been used to explore the plasticity onset under contact loading in InP. Under low indenting loads ranging between 0.2 and 10 mN, fracture of the sample is avoided and plastic zones can be observed by transmission electron microscopy. The zone-size variation with load could he measured and analysed using the work of Johnson and of Kramer et al. The results were compared with those obtained in GaAs deformed under the same conditions. Furthermore, characterization of the dislocations was made and it was shown that the twinning formation in InP differed strongly from that in GaAs. The results are compared with previously reported arrangements obtained in the microindentation domain. [References: 21]
机译:纳米压痕已被用于研究InP中接触载荷下的可塑性开始。在0.2至10 mN的低压入载​​荷下,可以避免样品破裂,并且可以通过透射电子显微镜观察到塑性区。可以使用Johnson和Kramer等人的工作来测量和分析带负载的区域大小变化。将结果与在相同条件下变形的GaAs中获得的结果进行比较。此外,对位错进行了表征,结果表明InP中的孪晶形成与GaAs中的孪生形成存在很大差异。将结果与先前在微压痕域中获得的报告进行比较。 [参考:21]

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