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Mechanisms of energy dissipation during displacement-sensitive indentation in Ge single crystals at elevated temperatures

机译:锗单晶在高温下位移敏感压痕过程中的能量耗散机理

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Load-displacement indentation tests have been performed in Ge single crystals on a newly designed displacement-sensitive hardness tester in the temperature range 20-450 degrees C. The deformation substructure in the vicinity of the indentation impressions was investigated using selective etching. The energy dissipated during the loading-unloading indentation cycle has been measured and compared with the extent and the structure of the deformation zone. Mechanisms of plastic flow and fracture during indentation are discussed. [References: 19]
机译:在新设计的位移敏感硬度测试仪上,在20-450摄氏度的温度范围内对Ge单晶进行了载荷-位移压痕测试。使用选择性蚀刻对压痕压痕附近的变形子结构进行了研究。测量了在加载/卸载压痕循环期间耗散的能量,并将其与变形区的范围和结构进行了比较。讨论了压痕过程中塑性流动和断裂的机理。 [参考:19]

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