Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

Sitek Janusz; Steplewski Wojciech; Janeczek Kamil; Koscielski Marek; Lipiec Krzysztof; Ciszewski Piotr; Krzaczek Tomasz

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Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

机译：封装级封装（PoP）技术中组装参数对无铅焊点可靠性的影响

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摘要

Purpose - The purpose of this paper is to evaluate the influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) Technology and demonstrate factors important for this issue.

机译：目的-本文的目的是评估封装参数（PoP）中组装参数对无铅焊点可靠性的影响，并说明对该问题至关重要的因素。

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来源
《Soldering & Surface Mount Technology》 |2015年第3期|共5页
作者
Sitek Janusz; Steplewski Wojciech; Janeczek Kamil; Koscielski Marek; Lipiec Krzysztof; Ciszewski Piotr; Krzaczek Tomasz;
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正文语种 eng
中图分类焊接一般性问题;
关键词
PoP systems; PoP technology; SMT; Solder joints reliability;

机译：PoP系统;PoP技术;SMT;焊点可靠性;

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专利

1. Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology [J] . Sitek Janusz, Steplewski Wojciech, Janeczek Kamil, Soldering & Surface Mount Technology . 2015,第3期

机译：封装级封装（PoP）技术中组装参数对无铅焊点可靠性的影响
2. Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders [J] . Shi-Wei Ricky Lee, Ben Hoi Wai Lui, Y. H. Kong, Soldering & Surface Mount Technology . 2002,第3期

机译：评估使用无铅焊料的PBGA组件的板级焊点可靠性
3. SOLDER CREEP-FATIGUE MODEL PARAMETERS FOR SAC & SNAG LEAD-FREE SOLDER JOINT RELIABILITY ESTIMATION [J] . Werner Engelmaier The Journal of the Reliability Analysis Center . 2011,第2期

机译：用于SAC和SNAG无铅焊点接头可靠性估计的焊点蠕变疲劳模型参数
4. Influence of soldering condition on structure and reliability of solder joints made in Package-on-Package technology [C] . Marek Kościelski, Janusz Sitek Electronic System-Integration Technology Conference . 2016

机译：焊接条件对叠层封装技术中焊点结构和可靠性的影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. The Influence of Incorporated Additives in Lead-Free Electroless Nickel Plating Film on the Reliability of Solder Joint [O] . Tetsuyuki Tsuchida, Toshikazu Okubo, Takahiro Kano, 2013

机译：掺入无铅无电镀镍电镀膜对焊点可靠性的掺入添加剂的影响

Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

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