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Enhancement of the self-healing ability in oxidation induced self-healing ceramic by modifying the healing agent

机译:通过改性愈合剂增强氧化诱导的自愈陶瓷的自愈能力

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The available temperature range of the self-healing induced by high temperature oxidation of SiC can be controlled by the particle size of the contained SiC particles. In this study, three types of alumina-SiC composites were prepared. The SiC particle sizes of the composites were 270, ~30nm, and less than 10 nm. The self-healing abilities were estimated by the strength recovery behavior at several temperatures. The use of nanometer-sized dispersed SiC particles as healing agent decreases the activation energy of the SiC oxidation obtained from the differential thermal analysis with several heating rates. This implies that smaller SiC particles can give rise to the oxidation at lower temperature. Moreover, the lowest temperature at which the cracked strength was completely recovered for 10h was strongly affected by the SiC particle size. As the SiC particle size varied from 270 to ~30nm, the lowest temperature varied from 1300 to 950°C. However, alumina composite containing SiC particles whose particle size is less than 10nm cannot recover completely the cracked strength under every condition, because the space between crack walls cannot be filled with the formed oxide due to the small volume of SiC on the crack walls. Therefore, it was found that there is an optimal SiC particle size for endowing self-healing ability.
机译:由SiC的高温氧化引起的自修复的可用温度范围可以通过所包含的SiC颗粒的粒径来控制。在这项研究中,制备了三种类型的氧化铝-SiC复合材料。复合材料的SiC粒径为270,〜30nm,小于10nm。通过在几个温度下的强度恢复行为来估计其自我修复能力。使用纳米级分散的SiC颗粒作为固化剂会降低以数种加热速率从差热分析获得的SiC氧化的活化能。这意味着较小的SiC颗粒可在较低温度下引起氧化。此外,SiC粒径强烈影响了裂纹强度完全恢复10h的最低温度。随着SiC粒径从270到〜30nm变化,最低温度从1300到950℃变化。但是,粒径小于10nm的含有SiC颗粒的氧化铝复合材料不能在所有条件下完全恢复破裂强度,这是因为由于破裂壁上SiC的体积小,所以破裂壁之间的空间不能被形成的氧化物填充。因此,发现对于赋予自愈能力存在最佳的SiC粒径。

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