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Optical and Electrical Properties of 4H-SiC Irradiated with Xe Ions

机译:氙离子辐照4H-SiC的光电性能

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摘要

Structures with aluminum-ion-implanted p~+–n junctions formed in 26-μm-thick chemicalvapor-deposited-epitaxial 4H-SiC layers with an uncompensated donor concentration N_d–N_a = (1–3) × 10~(15) cm~(-3) are irradiated with 167-MeV Xe ions at fluences of 4 × 10~9 to 1 × 10~(11) cm~(–2) and temperatures of 25 and 500°C. Then as-grown and irradiated structures are thermally annealed at a temperature of 500°C for 30 min. The as-grown, irradiated, and annealed samples are analyzed by means of cathodoluminescence, including the cross-sectional local cathodoluminescence technique, and electrical methods. According to the experimental data, radiation defects penetrate to a depth in excess of several tens of times the range of Xe ions. Irradiation of the structures at 500°C is accompanied by "dynamic annealing" of some low-temperature radiation defects, which increases the radiation resource of 4H-SiC devices operating at elevated temperatures.
机译:在厚度为26μm的化学气相沉积外延4H-SiC层中形成铝离子注入p〜+ –n结的结构,施主浓度N_d–N_a =(1–3)×10〜(15)cm用167-MeV Xe离子辐照〜(-3),注量为4×10〜9至1×10〜(11)cm〜(–2),温度为25和500°C。然后,将已生长和辐照的结构在500°C的温度下热退火30分钟。通过阴极发光,包括横截面局部阴极发光技术和电学方法,对生长,辐照和退火的样品进行分析。根据实验数据,辐射缺陷的渗透深度超过Xe离子范围的几十倍。在500°C下辐照结构会伴随一些低温辐射缺陷的“动态退火”,这会增加在高温下工作的4H-SiC器件的辐射资源。

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