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Electrical Properties of Silicon Layers Implanted with Erbium and Oxygen Ions in a Wide Dose Range and Thermally Treated in Different Temperature Conditions

机译:宽剂量范围内注入Er和氧离子并在不同温度条件下进行热处理的硅层的电性能

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摘要

The electrical properties of silicon implanted with Er and O ions in a wide dose range have been studied. The dependence of electron mobility on the concentration of electrically active centers is determined for Si:Er layers with Er concentrations in the range of 9 * 10~(15) - 8 * 10~(16)cm~(-3). Sharp bends related to specific features of Er segregation in solid-phase epitaxial recrystallization are observed in the concentration profiles of electrically active centers, n(x), and Er atoms, C(x), at Er ion implantation doses exceeding the amorphization threshold. The n(x) and C(x) profiles virtually coincide near the surface. A linear rise in the maximum concentration of electrically active centers at approximately constant effective coefficient of their activation, k, is observed at Er implantation doses exceeding the amorphization threshold. At an Er concentration higher than 7 * 10~(19)cm~(-3), the concentration of electrically active centers levels off and k decreases.
机译:已经研究了在宽剂量范围内注入Er和O离子的硅的电学性质。对于Er浓度为9 * 10〜(15)-8 * 10〜(16)cm〜(-3)的Si:Er层,确定了电子迁移率对电活性中心浓度的依赖性。在Er离子注入剂量超过非晶化阈值时,在电活性中心n(x)和Er原子C(x)的浓度曲线中观察到与固相外延再结晶中Er偏析的特定特征有关的急剧弯曲。 n(x)和C(x)轮廓在表面附近几乎重合。在超过非晶化阈值的Er注入剂量下,观察到电活性中心的最大浓度在其激活的近似恒定有效系数k处线性增加。当Er浓度高于7 * 10〜(19)cm〜(-3)时,电活性中心的浓度趋于平稳,k减小。

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