Micro-Pattern Fabrication for Medical Device Applications

摘要

This paper presents the processes used to fabricate the micro-patterns on the ultrathin flexible substrate for medical device applications. Unlike hard board containing woven glass fibers that tend to result in signal loss, polyimide is used as a substrate to enhance the functionality of medical devices. To achieve fine line circuitization, a semi-additive with pulse plating Cu process on flexible polyimide substrate was employed. The key technical challenges in developing the processes used to fabricate the micro-pattern include use of the ultra-thin polyimide flexible material and the fine line circuitization required for miniaturization. The fine pitch patterns were characterized using 3D Laser Scanning Microscope. The surface roughness measurement results show that the pulsed current plating of Cu films on polyimide substrates can lead to a more uniform surface than that obtained by the conventional direct current plating. The fine grained films can then results a better surface roughness and make electronic off chip interconnection more reliable for healthcare applications.