Microcup Array Fabricated by Thermal Imprint Lithography for E-Paper Application

摘要

Thermal imprinting method was developed to provide a microcup array for the application to e-paper, and the imprinted feature was investigated as functions of time and temperature. Even in a short period of time of 2 second, the pattern was imprinted onto a resin to the full depth at a temperature higher than T/T_g = 0.64 (where the T_g is 156 deg C), however, the hardening process as long as 30 minutes appears to be necessary to achieve the full mechanical strength. We propose a roller imprint process that suffices the two experimental observations and is put to practical use. A large array of microcup having typical dimension in the range of 60-100 mu m in width or length, 20-40 mu m in height, and 10-20 mu m in width of partition walls was able to be fabricated via the roller imprint method.