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The influence of interaction geometry on the obstacle strength of voids and copper precipitates in iron

机译:相互作用的几何形状对铁中空洞和铜沉淀物的阻挡强度的影响

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摘要

Interaction between a 1/2{1 1 1}{1 1 0} edge dislocation and voids or coherent bcc Cu precipitates (diameter D = 2 or 4 nm) in Fe with their centre displaced by±δz from the dislocation glide plane is investigated by computer simulation for temperature T = 0 to 450 K. Voids provide the highest critical stress, τ_c, when δz = 0. The dislocation climbs up on release when δz ≥ 0, but down when δz < 0. Void-surface facets influence the sense of climb. There is no correspondence between τ_c and the sense or magnitude of climb. 2 nm precipitates give highest τc when δz < 0 and lowest when δz > 0, due to a combination of the modulus difference and size misfit between bcc Cu and Fe. 4 nm precipitates are partially transformed to fcc structure by the dislocation when T ≤ 300K and δz ≥ 0. Surprisingly, the transformed fraction of Cu at low T is highest for δz = D/2, due to the compressive field of the dislocation. The geometries that produce large transformed fractions result in the lowest τ_c, in contrast to expectation from previous studies.
机译:研究了1/2 {1 1 1} {1 1 0}边缘位错与Fe中的空隙或相干bcc Cu析出物(直径D = 2或4 nm)之间的相互作用,其中心从位错滑行平面偏移了±δz通过计算机模拟,温度T = 0至450K。当δz= 0时,空隙提供了最大的临界应力τ_c。当δz≥0时,位错在释放时上升,而当δz<0时,位错下降。攀爬感。 τ_c与爬升的感觉或幅度之间没有对应关系。由于bcc Cu和Fe之间的模量差和尺寸失配的组合,当δz<0时,2 nm析出物给出最高τc,当δz> 0时给出最低τc。当T≤300K且δz≥0​​时,通过位错将4 nm沉淀物部分转变为fcc结构。令人惊讶的是,由于位错的压缩场,低T时Cu的转化分数最高,对于δz= D / 2。与先前研究的预期相反,产生较大转换分数的几何形状导致最低τ_c。

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