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Structural dynamics of electronic systems

机译:电子系统的结构动力学

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摘要

The published work on analytical (?mathematical?) and computer-aided, primarily finite-element-analysis (FEA) based, predictive modeling of the dynamic response of electronic systems to shocks and vibrations is reviewed. While understanding the physics of and the ability to predict the response of an electronic structure to dynamic loading has been always of significant importance in military, avionic, aeronautic, automotive and maritime electronics, during the last decade this problem has become especially important also in commercial, and, particularly, in portable electronics in connection with accelerated testing of various surface mount technology (SMT) systems on the board level. The emphasis of the review is on the nonlinear shock-excited vibrations of flexible printed circuit boards (PCBs) experiencing shock loading applied to their support contours during drop tests. At the end of the review we provide, as a suitable and useful illustration, the exact solution to a highly nonlinear problem of the dynamic response of a ?flexible-and-heavy? PCB to an impact load applied to its support contour during drop testing.
机译:回顾了已发表的有关分析(“数学”)和计算机辅助(主要是有限元分析(FEA))的电子系统对冲击和振动的动态响应的预测模型的工作。尽管了解电子结构的物理特性和预测电子结构对动态载荷响应的能力在军事,航空电子,航空,汽车和航海电子领域一直非常重要,但在最近十年中,这个问题在商业领域也变得尤为重要,尤其是在便携式电子产品中,它需要在板上进行各种表面贴装技术(SMT)系统的加速测试。审查的重点是在跌落测试期间,柔性印刷电路板(PCB)在承受支撑轮廓时承受冲击载荷的非线性激振。在回顾的最后,我们提供了一个适当而有用的说明作为对“柔性重”动力响应的高度非线性问题的精确解决方案。 PCB在跌落测试期间施加到其支撑轮廓的冲击载荷。

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