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Thermoelastic coupled modeling for a thermal bimorph actuator

机译:热双压电晶片执行器的热弹性耦合建模

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This paper presents a theoretical thermoelastic coupled model for a thermal bimorph actuator driven by a harmonically varying thermal load in micro-electro-mechanical systems. The thermoelastic coupling, which arises from the coupling of the strain rate to the temperature field of the heat transport, is considered in this model. The frequency responses are simulated using the theorem of eigenmode expansion. The effects of thermoelastic coupling on the resonant frequency and the quality factor Q for each eigenmode resonance of the deflection are calculated and compared with the same effects resulted from air damping. It shows that for the example of an aluminum-polysilicon thermal bimorph actuator, the resonant frequencies are generally shifted downward with the order larger than that of air damping, whereas the influence of thermoelastic coupling on the Q is more significant than that of air damping under high vacuum level. (c) 2007 Elsevier Ltd. All rights reserved.
机译:本文提出了一种由微机电系统中的谐波变化热负荷驱动的热双压电晶片执行器的理论热弹耦合模型。在该模型中考虑了热弹性耦合,该热弹性耦合是由应变率与热传输温度场的耦合引起的。使用本征模扩展定理模拟频率响应。计算挠度对每个本征模共振的热弹性耦合对共振频率和品质因数Q的影响,并与空气阻尼产生的相同影响进行比较。它表明,以铝-多晶硅热双压电晶片致动器为例,谐振频率通常以比空气阻尼大的数量级向下移动,而热弹性耦合对Q的影响要比空气阻尼大。高真空度。 (c)2007 Elsevier Ltd.保留所有权利。

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