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首页> 外文期刊>Materials science in semiconductor processing >Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors
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Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors

机译:基于光学填充技术的基于电流的微观缺陷分析方法的开发,用于研究高辐射高电阻率Si传感器/检测器的缺陷

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摘要

Current-based microscopic defect analysis method such as current deep level transient spectroscopy (I-DLTS) and thermally stimulated current have been developed over the years at Brookhaven National Laboratory (BNL) for the defect characterizations on heavily irradiated (Phi(n) >= 10(13) n/cm(2)) high-resistivity (>= 2 k Omega cm) Si sensors/detectors. The conventional DLTS method using a capacitance transient is not valid on heavily irradiated high-resistivity Si sensors/detectors. A new optical filling method, using lasers with various wavelengths, has been applied, which is more efficient and suitable than the traditional voltage-pulse filling. Optimum defect-filling schemes and conditions have been suggested for heavily irradiated high-resistivity Si sensors/detectors. (c) 2006 Published by Elsevier Ltd.
机译:多年来,布鲁克海文国家实验室(BNL)已开发出基于电流的微观缺陷分析方法,例如电流深电平瞬态光谱法(I-DLTS)和热激励电流,用于表征强辐射(Phi(n)> = 10(13)n / cm(2))高电阻率(> = 2 k Omega cm)硅传感器/检测器。使用电容瞬态的常规DLTS方法在强辐射的高电阻率Si传感器/检测器上无效。已经应用了一种新的光学填充方法,该方法使用各种波长的激光,比传统的电压脉冲填充方法更加有效和适合。对于高辐射高电阻率Si传感器/检测器,已经提出了最佳的缺陷填充方案和条件。 (c)2006年由Elsevier Ltd.发布。

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