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Characterization of Electroplated Platinum-Iridium Alloys on the Nickel-Base Single Crystal Superalloy

机译:镍基单晶高温合金上电镀铂铱合金的表征

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As a high temperature protective layer, platinum-indium alloys were electroplated on the nickel-base single crystal superalloy TMS-82+ from amido sulfuric acid solutions by the direct current method. It was found that Ir content in the films was always lower than the ratio of concentration ([Ir~(3+)]/([PtCl_6~(2-)] + [Ir~(3+)])) in the electrolytes, indicating that preferential deposition of Pt occurred in this study. The as-deposited Pt-Ir films formed an fee single phase structure with a granular surface. When Ir content exceeded 3 at percent, Pt-Ir films exhibited the (111) preferred growth orientation. It was also found that pre-deposition of Ni and Pt promoted the deposition rate and changed composition of overlaying Pl-Ir films.
机译:作为高温保护层,通过直流电法从酰胺基硫酸溶液中将铂铟合金电镀到镍基单晶高温合金TMS-82 +上。发现膜中的Ir含量始终低于电解质中的浓度比([Ir〜(3 +)] /([PtCl_6〜(2-)] + [Ir〜(3+)]))。 ,表明该研究中发生了Pt的优先沉积。沉积的Pt-Ir膜形成具有颗粒表面的单相结构。当Ir含量超过3at%时,Pt-Ir膜表现出(111)优选的生长取向。还发现Ni和Pt的预沉积促进了沉积速率并改变了覆盖的Pl-Ir膜的组成。

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