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Grain structure, texture evolution and deformation mechanism during low temperature superplasticity in 5083 Al-Ma alloy

机译:5083 Al-Ma合金低温超塑性过程中的晶粒组织,织构演变和变形机理

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Low temperature superplasticity (LTSP) was observed in the 5083 Al-Mg base alloy after thermomechanical treatments (TMT). The maximum LTSP elongation was 400%, occurring at 250℃and 1×10{sup}(-3)s{sup}(-1) The subgrain structures formed duringTMT transformed to better defined subgrains to ~0.5μm upon heating to 250℃. Further static annealing or superplastic straining at 250℃ would produce well defined fine grains to 1.5-2.5μm, dependent on annealing time or strain level. Superplasticloading would accelerate grain evolution rate. The near brass {110}<112> and S {123}<634> texture components in the as-TMT specimens evolved into a random orientation distribution after LTSP loading to 100% at 250℃. Static annealing at 250℃ itself could not alter the existing texture. Under the optimum LTSP condition, the m-value was ~0.5, compared with 0.2 for the as-received coarse-grained 5083 alloy. The activation energy Q-value was around 50-90 kJ/mol for LTSP over 200-300℃ and around 145 kJ/molfor HTSP over 400-550℃. It is postulated that the rate controlling deformation mechanism in the TMT processed specimens was grain boundary sliding during the optimum LTSP condition and solute drag creep during HTSP deformation.
机译:经过热机械处理(TMT)后,在5083 Al-Mg基合金中观察到低温超塑性(LTSP)。 LTSP的最大伸长率为400%,在250℃和1×10 {sup}(-3)s {sup}(-1)时发生。进一步的静态退火或在250℃下的超塑性应变将产生清晰的晶粒,晶粒细度可达1.5-2.5μm,具体取决于退火时间或应变水平。超塑性加载将加快晶粒的发展速度。在250℃LTSP加载至100%后,as-TMT样品中的近黄铜{110} <112>和S {123} <634>织构成分演变成随机取向分布。 250℃下的静态退火本身不会改变现有的织构。在最佳LTSP条件下,m值为〜0.5,而原样的5083合金的m值为0.2。 200-300℃以上的LTSP的活化能Q值约为50-90 kJ / mol,400-550℃以上的HTSP的活化能Q值约为145 kJ / mol。据推测,TMT加工试样的速率控制变形机理是在最佳LTSP条件下晶界滑动和在HTSP变形过程中溶质阻力蠕变。

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