A breakthrough in core IC equipment RD and industrialization

摘要

A major special project of integrated circuit (IC) manufacturing equipment of the National High-tech Research and Development Program, dubbed "863" Program, passed the acceptance check jointly organized by the Ministry of Science and Technology and Beijing Municipality on Sept. 28 in Beijing. This event marks an important breakthrough in the development of the 100nm high density plasma etching tool and large-angle ion implantation apparatus, a core equipment for IC manufacturing, and an encouraging step forward in the proprietary innovation and industrialization of this field. As a major partner of the project, the CAS Institute of Microelectronics took part in the entire RD process, making key contributions to the successful development of the equipment.