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Mode I fatigue crack growth reduction mechanisms after a single Mode II load cycle

机译:单一模式II负载循环后的模式I疲劳裂纹扩展减少机制

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摘要

A single Mode II load cycle, large enough to create residual displacements, decreases the subsequent Mode I crack growth rate. The distance for Mode I crack growth rate to fully recover, i.e., revert to the same da/dN as before Mode II load, is much longer than Mode II plastic zone size. The higher Mode II load, the larger is the reduction in growth rate and the longer the recovery distance. Higher Mode I R-ratio means smaller reduction in growth rate. Above a certain R-ratio, no reduction occurs at all. In the present study it is found that the reduction in growth rate is solely caused by crack closure due to tangential displacement of crack-surface irregularities that induce a surface mismatch between the upper and lower crack faces. The mechanism is called Mode II-induced crack closure. A model based on both analytical and experimental results is developed in order to estimate the degree of Mode II-induced crack closure after a Mode II load.
机译:单个模式II的载荷周期足够大以产生残余位移,从而降低了随后的模式I裂纹扩展速率。模式I裂纹扩展速率完全恢复的距离(即恢复为与模式II加载之前相同的da / dN),比模式II塑性区大小要长得多。模式II负载越高,增长率降低的幅度越大,恢复距离越长。模式I R比率越高,意味着增长率降低越小。超过某个R比率,完全没有降低。在本研究中发现,增长率的降低完全是由于裂纹闭合引起的,该裂纹闭合是由于裂纹表面不规则性的切向位移而引起的,该裂纹导致上,下裂纹面之间的表面不匹配。该机制称为模式II引起的裂纹闭合。建立了一个基于分析和实验结果的模型,以估计在II型载荷后II型引起的裂纹闭合程度。

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