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首页> 外文期刊>Electrochimica Acta >Gold thin-film electrodes: an EQCM study of the influence of chromium and titanium adhesion layers on the response
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Gold thin-film electrodes: an EQCM study of the influence of chromium and titanium adhesion layers on the response

机译:金薄膜电极:EQCM研究铬和钛粘附层对响应的影响

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The effect of the adhesion layer between gold films and quartz on the response of an electrochemical quartz crystal microbalance (EQCM) has been investigated in 0.1 M HClO{sub}4 and in 0.1 M phosphate buffer pH 7.4. Cyclic voltammetry (CV) was applied in an anodic potential range, with polished and unpolished crystals, provided with a Cr or Ti adhesion layer. Crystals with Cr undercoatings showed-in HClO{sub}4 and in buffer-oxidation currents and frequency' shifts due to dissolution of Cr in a potential range in which gold oxidation also takes place. This led to loss of resonance of the crystal and/or to an increase in surface roughness. The deleterious effects of Cr are most pronounced with unpolished crystals. Crystals with Ti undercoatings neither showed a sign of oxidation or dissolution of adhesion metal, nor a significant increase in surface roughness upon repeated cycling, probably due to passivation of Ti by a thin oxide film, and its resistance to dissolution. The small positive frequency shifts observed upon repeated cycling in stirred solutions of HClO{sub}4 and phosphate buffer, with unpolished crystals in particular, are most likely due to dissolution of gold. The oxygen chemisorption on gold in HClO{sub}4 and in buffer, and the enhanced dissolution of gold in the presence of small concentrations (0.5 mM) of chloride in HClO{sub}4, could be very well studied with Ti-coated crystals. For applications in the anodic potential range (extending into the region of oxygen chemisorption on gold), crystals with Cr adhesion layers should not be used.
机译:在0.1 M HClO {sub} 4和0.1 M磷酸盐缓冲液pH 7.4中研究了金膜和石英之间的粘附层对电化学石英晶体微天平(EQCM)响应的影响。循环伏安法(CV)在阳极电位范围内使用,抛光和未抛光的晶体带有Cr或Ti粘附层。具有Cr底涂层的晶体在HClO {sub} 4中表现出缓冲氧化作用,由于Cr在可能发生金氧化的电位范围内溶解,电流和频率也发生了变化。这导致晶体的共振损失和/或表面粗糙度的增加。铬的有害作用在未抛光的晶体中最为明显。带有Ti底涂层的晶体既没有显示出粘附金属的氧化或溶解的迹象,也没有显示出在重复循环后表面粗糙度的显着增加,这可能是由于薄的氧化膜对Ti的钝化及其抗溶解性造成的。在HClO {sub} 4和磷酸盐缓冲液的搅拌溶液(尤其是未抛光的晶体)的搅拌溶液中重复循环时观察到的小正频移很可能是由于金的溶解。钛涂层晶体可以很好地研究HClO {sub} 4和缓冲液中金上的氧化学吸附,以及在HClO {sub} 4中少量氯化物(0.5 mM)的存在下金的增强溶解。 。对于在阳极电势范围内的应用(扩展到金上的氧化学吸附区域),不应使用具有Cr粘附层的晶体。

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