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Design and Fabrication of Terahertz Detectors Based on 180-nm CMOS Process Technology

机译:基于180nm CMOS工艺技术的太赫兹探测器的设计与制造

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摘要

A CMOS cascode amplifier, biased near the threshold voltage of a MOSFET, for terahertz direct detection is proposed. A CMOS terahertz imaging circuit (size: 250 × 180 μm) is designed and fabricated on the basis of low-cost 180-nm CMOS process technology. The imaging circuit consists of a microstrip patch antenna, an impedance-matching circuit, and a direct detector. It achieves a responsivity of 51.9 kV/W at 0.915 THz and a noise equivalent power (NEP) of 358 pW/Hz1/2 at a modulation frequency of 31 Hz. NEP is estimated to be reduced to 42 pW/Hz1/2 at 100 kHz. These results suggest that cost-efficient terahertz imaging is possible in the near future.
机译:提出了一种偏置在MOSFET阈值电压附近的CMOS级联放大器,用于太赫兹直接检测。 CMOS太赫兹成像电路(尺寸:250×180μm)是基于低成本的180 nm CMOS工艺技术设计和制造的。成像电路由微带贴片天线,阻抗匹配电路和直接检测器组成。它在0.915 THz时可实现51.9 kV / W的响应度,在31 Hz的调制频率下可实现358 pW / Hz1 / 2的噪声等效功率(NEP)。估计在100 kHz时NEP会降低到42 pW / Hz1 / 2。这些结果表明,在不久的将来可能实现具有成本效益的太赫兹成像。

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