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首页> 外文期刊>International Journal of Electrical Engineering: Transactions of the Chinese Institute of Engineers, Series E >ALUMINUM-INDUCED CRYSTALLIZATION OF POLY-CRYSTALLINE SILICON-GERMANIUM THIN FILMS
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ALUMINUM-INDUCED CRYSTALLIZATION OF POLY-CRYSTALLINE SILICON-GERMANIUM THIN FILMS

机译:铝诱导的多晶硅锗薄膜的结晶

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摘要

In this work, the growth of poly-crystalline silicon-germanium (poly-SiGe) thin films on single-crystalline silicon (sc-Si) substrates by aluminum-induced crystallization (AIC) has been investigated at low temperatures. Experimentally, the aluminum and amorphous germanium (a-Ge) films were evaporated onto the sc-Si substrates to form the a-Ge/Al/sc-Si structure and then annealed at 550℃. The XRD results show that the initial transition from amorphous structure to polycrystalline structure occurs after 20 minutes of AIC annealing at a temperature of 550℃. The fraction x of the poly-SixGel-x is increased with the annealing time due to the limited Ge amount in the Ge/Al/sc-Si structure.
机译:在这项工作中,已经研究了在低温下通过铝诱导结晶(AIC)在单晶硅(sc-Si)衬底上生长多晶硅锗(poly-SiGe)薄膜的方法。实验中,将铝和非晶锗(a-Ge)膜蒸发到sc-Si衬底上以形成a-Ge / Al / sc-Si结构,然后在550℃退火。 XRD结果表明,在550℃的温度下进行了20分钟的AIC退火后,发生了从非晶态到多晶态的初始转变。由于Ge / Al / sc-Si结构中有限的Ge含量,聚SixGel-x的分数x随退火时间而增加。

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