首页> 外文期刊>Australian endodontic journal : >Push-out bond strength of two root-end filling materials in root-end cavities prepared by Er,Cr: YSGG laser or ultrasonic technique
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Push-out bond strength of two root-end filling materials in root-end cavities prepared by Er,Cr: YSGG laser or ultrasonic technique

机译:用Er,Cr:YSGG激光或超声技术制备的根端腔中两种根端填充材料的推出强度

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摘要

This study compared the push-out bond strength of mineral trioxide aggregate (MTA) and a new endodontic cement (NEC) as root-end filling materials in root-end cavities prepared by ultrasonic technique (US) or Er,Cr:YSGG laser (L). Eighty single-rooted extracted human teeth were endodontically treated, apicectomised and randomly divided into four following groups (n=20): US/MTA, US/NEC, L/MTA and L/NEC. In US/MTA and US/NEC groups, root-end cavities were prepared with ultrasonic retrotip and filled with MTA and NEC, respectively. In L/MTA and L/NEC groups, root-end cavities were prepared using Er,Cr:YSGG laser and filled with MTA and NEC, respectively. Each root was cut apically to create a 2mm-thick root slice for measurement of bond strength using a universal testing machine. Then, all slices were examined to determine the mode of bond failure. Data were analysed using two-way anova. Root-end filling materials showed significantly higher bond strength in root-end cavities prepared using ultrasonic technique (US/MTA and US/NEC) (P<0.001). The bond strengths of MTA and NEC did not differ significantly. The failure modes were mainly adhesive for MTA, but cohesive for NEC. In conclusion, bond strengths of MTA and NEC to root-end cavities were comparable and higher in ultrasonically prepared cavities.
机译:这项研究比较了用超声技术(US)或Er,Cr:YSGG激光制备的根端腔中三氧化二矿骨料(MTA)和新型牙髓胶(NEC)的根端填充材料的推出强度( L)。对80根单根拔出的人牙进行牙髓治疗,切牙切除术,并随机分为以下四个组(n = 20):US / MTA,US / NEC,L / MTA和L / NEC。在US / MTA和US / NEC组中,用超声逆针制备根端腔并分别用MTA和NEC填充。在L / MTA和L / NEC组中,使用Er,Cr:YSGG激光制备根端腔并分别填充MTA和NEC。切开每个根部,以创建2mm厚的根部切片,以使用通用测试机测量粘合强度。然后,检查所有切片以确定粘结破坏的模式。使用双向方差分析对数据进行分析。根端填充材料在使用超声技术(US / MTA和US / NEC)制备的根端腔中显示出明显更高的粘结强度(P <0.001)。 MTA和NEC的粘结强度没有显着差异。失效模式主要是MTA粘合的,而NEC粘合的。总之,MTA和NEC与根端腔的粘结强度相当,在超声制备的腔中更高。

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