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Analysis of the oxygen impurity atoms beneath the surface of Cz-silicon by CPAA

机译:CPAA分析Cz硅表面下的氧杂质原子

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摘要

Charged particle activation analysis (CPAA) is able to analyze light elements such as carbon, nitrogen and oxygen at trace levels in materials. By comparison with other techniques such as Fourier transform infrared spectroscopy (FTIR), the major advantage of the CPAA is its ability to determine the total concentration of impurities (interstitial, substitutional or incorporated in a complex). Errors due to matrix effects and surface contamination are eliminated. However, this technique does not allow analysis in the first micrometers beneath the surface because the chemical etching, required to rid the surface of superficial contaminants, removes this important part of the compounds’ active zone. The aim of this study is to solve this problem and as a result to be able to determine impurities in the vicinity of the surface. An application on oxygen diffusion profiles in Cz-silicon submitted to a rapid thermal annealing (RTA) will be discussed.
机译:带电粒子活化分析(CPAA)能够分析材料中痕量水平的轻元素,例如碳,氮和氧。通过与诸如傅里叶变换红外光谱(FTIR)之类的其他技术进行比较,CPAA的主要优势在于它能够确定杂质(间隙,取代或掺入复合物)的总浓度。消除了由于基体效应和表面污染引起的误差。但是,该技术不允许在表面以下的第一微米进行分析,因为去除表面污染物的化学蚀刻去除了化合物活性区域的这一重要部分。这项研究的目的是解决这个问题,从而能够确定表面附近的杂质。将讨论在Cz硅中进行快速热退火(RTA)的氧扩散曲线的应用。

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