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Enhancing the densification of ceria ceramic at low temperature via the cold sintering assisted two-step sintering process

机译:通过冷烧结辅助两步烧结工艺增强低温下电气陶瓷的致密化

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摘要

The cold sintering process (CSP) in the transient aqueous environment of malonic acid is applied in this study to enhance the densification behavior of ceria ceramics at a significantly reduced sintering temperature. Dense ceria ceramics ( 98% relative density) could be achieved after CSP at 180 degrees C, followed by the sintering at 1100 degrees C/4 h. As expected, the CSP can improve the compaction of the particles before sintering, resulting in ceria ceramics with a fine microstructure of submicrometer scale of grain sizes. All samples show the single phase of cubic fluorite structure with no significant change of lattice parameter. Finally, electrical conductivity of CSP and conventionally sintered ceramics is investigated. This communication emphasizes the advantage of the CSP to reduce the sintering temperature without deterioration of the structure and properties of the final ceramics.
机译:在本研究中应用阳性水酸的瞬时水环境中的冷烧结过程(CSP),以提高Ceria陶瓷在显着降低的烧结温度下的致密化行为。 CSP在180℃下CSP后可以实现致密的二氧化铈陶瓷(相对密度),然后在1100℃/ 4小时下烧结。 如预期的那样,CSP可以在烧结之前改善颗粒的压实,导致有纤维陶瓷具有细微结构的粒度尺度微观结构。 所有样品均显示立方萤石结构的单相,没有明显变化的晶格参数。 最后,研究了CSP和常规烧结陶瓷的电导率。 该通信强调CSP的优点,以降低烧结温度而不会劣化最终陶瓷的结构和性质。

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