首页> 外文期刊>Электронная Обработка Материалов >Researches of influence ultra-fine grained of structure of copper Ml on electrochemical machining in a comparison with initial analog
【24h】

Researches of influence ultra-fine grained of structure of copper Ml on electrochemical machining in a comparison with initial analog

机译:与初始模拟相比,电化学加工铜ML结构的影响超细颗粒的研究

获取原文
获取原文并翻译 | 示例
           

摘要

The comparison of characteristics of anodic dissolution of copper Ml with ultra-micro-grained structure in a comparison with its coarse-grained analog under conditions of electrochemical machining of metals (ECM) has been carried out. The influence of material structure on ECM characteristics (machining rate, localization coefficient, surface finishing) in chloride and nitrate solutions with different concentrations is shown. It is shown that the influence of material structure is much higher in passivating electrolytes (nitrate solutions) due to the features of surface oxide films shaping
机译:已经进行了在金属(ECM)的电化学加工条件下与超微粒结构的铜ml阳极溶解特性与超微粒性模拟的比较。 显示了材料结构对具有不同浓度的氯化物和硝酸盐溶液中的ECM特性(加工速率,定位系数,表面精加工)的影响。 结果表明,由于表面氧化膜的特征,材料结构的影响大大钝化电解质(硝酸盐溶液)

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号