The selection of cristalles silicon for microsoldering irons

摘要

Heat release in different commercial diode crystals used in mass-produced medium-capacity diodes has been investigated to study the possibility of using them as heating elements for microsoldering irons. Structures of diodes of the KD-208 andKD-209 types characterized by a direct voltage drop and pin diodes have been investigated. Dependence of the electric power released in the crystals upon the soldering voltage and the heating element temperature has been determined. The KD-209 type diodestructures have been recommended for the use as the pulse semiconducting heating element.