Preparation of epoxy-based shape memory polymers for deployable space structures using diglycidyl ether of ethoxylated bisphenol-A

摘要

To develop epoxy-based shape memory polymers (ESMPs) with a high switching temperature and good mechanical and shape memory properties for deployable space structures, the crosslink density and chain flexibility of the conventional epoxy resin, diglycidyl ether of bisphenol-A, were controlled by adding a flexible epoxy resin, diglycidyl ether of ethoxylated bisphenol-A with six oxyethylene units (DGEEBA-6). With increasing DGEEBA-6 content, the crosslink density of the ESMPs increased, but their glass transition temperature (T-g) decreased. The ESMPs with suitable switching temperatures (120-135 degrees C) for deployable space structures showed enhanced toughness, modulus, tensile strength, elongation at break, and shape memory properties. The ESMPs had fast full recovery times of only 80s at T-g+20 degrees C. DGEEBA-6 was shown to be a good modifier of ESMPs for deployable space structures.