机译:基于关节高度的微尺度SAC305焊点力学行为的实验性和数值模拟
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Chongqing Univ Sci &
Technol Sch Met &
Mat Engn Chongqing 401331 Peoples R China;
Harbin Welding Inst Ltd Co Harbin 150028 Peoples R China;
Electronic packaging; Numerical simulation; Micro-scale solder joints; Fracture failure; Sn-3; 0Ag-0; 5Cu;
机译:基于关节高度的微尺度SAC305焊点力学行为的实验性和数值模拟
机译:同步加速器X射线微衍射和纳米压痕对高温时效对SAC305焊点组织和力学行为的影响
机译:基于Cu基电极界面的退火后SAC305焊点的金属间生长机理和力学性能
机译:利用纳米压痕技术研究SAC305焊点在极端高温下的力学行为
机译:微型SAC305焊点的微观结构和粘塑性行为的演变与机械疲劳损伤的关系。
机译:304不锈钢/ Q345R复合板焊接接头热力学行为的实验与数值研究
机译:304不锈钢/ Q345R复合板焊接接头热机械行为的实验性和数值研究
机译:基于微观结构的焊点行为有限元模拟