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首页> 外文期刊>Materials science & engineering, C. Materials for Biogical applications >Effect of annealing temperature on mechanical and antibacterial properties of Cu-bearing titanium alloy and its preliminary study of antibacterial mechanism
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Effect of annealing temperature on mechanical and antibacterial properties of Cu-bearing titanium alloy and its preliminary study of antibacterial mechanism

机译:退火温度对Cu承载钛合金机械和抗菌性能的影响及其抗菌机制的初步研究

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摘要

Cu-bearing titanium alloys are designed and studied as a novel medical metal material with antibacterial function. However, the addition of Cu would affect the mechanical properties of titanium alloy more or less, especially the ductility, despite its excellent antibacterial property. Thus, the aim of this study was to optimize the heat treatment for Cu-bearing titanium alloys in order to achieve a balance of satisfactory mechanical, antibacterial and other properties. In this study, Ti6Al4V-5 wt% Cu alloy was fabricated, and then different annealing treatments with various heating temperatures (700-910 degrees C) were employed on the alloy. The effects of heating temperature on microstructure evolution, mechanical properties, corrosion resistance and antibacterial performance of Ti6Al4V-5Cu alloy were systematically studied. It was found that annealing at 740 degrees C for Ti6Al4V-5Cu alloy showed the best comprehensive properties of high strength, excellent ductility, corrosion resistance and antibacterial performance. The Ti2Cu phases played an important role in the mechanical property and antibacterial performance for Ti6Al4V-5Cu alloy, and bacteria preferred to adhere on the a phase region, rather than the beta or globule Ti2Cu region.
机译:Cu承载钛合金设计和研究作为具有抗菌功能的新型医用金属材料。然而,尽管其优异的抗菌性能,但铜的加入将影响钛合金的机械性能,尤其是延展性。因此,本研究的目的是优化Cu承载钛合金的热处理,以实现令人满意的机械,抗菌和其他性能的平衡。在该研究中,制备Ti6Al4V-5wt%Cu合金,然后在合金上使用不同的加热温度(700-910℃)的不同退火处理。系统研究了加热温度对Ti6Al4V-5Cu合金的微观结构演化,机械性能,耐腐蚀和抗菌性能的影响。结果发现,对于Ti6Al4V-5Cu合金740℃的退火显示出高强度,优异的延展性,耐腐蚀性和抗菌性能的最佳综合性能。 Ti2Cu阶段在Ti6Al4V-5C-5Cu合金的机械性质和抗菌性能下发挥了重要作用,并且优选粘附在相位区域上的细菌,而不是β或球苗Ti2Cu区。

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