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Effect of ultrasonic transducer structure on friction plasticizing heating rate under the longitudinal vibration excitation

机译:超声换能器结构对纵向振动激励下摩擦加热速率的影响

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摘要

The different structural parameter combinations of the transducer and the interaction mechanism of friction heating and plasticizing polymer granulates under the longitudinal vibration excitation were introduced to study ultrasonic plasticizing of polymer granulates, the structure parameters of the ultrasonic transducer with known resonant frequency and the particle output amplitude at the tool head front end were utilized to establish the friction plasticizing heating equations of the polymer granulates under the longitudinal vibration excitation. The dominant influence relationship between the structural parameters of the transducer and the heating rate of the polymer granulates was obtained by using Mathematica software, the results of further regression analysis show that the amplification ratio of the horn has the greatest effect on the friction plasticizing heating rate in structure parameters of the longitudinal vibration transducer, the effect of the front cover length, the ultrasonic tool head length and the horn length on the heating rate are smaller, the influence of the thickness of the piezoelectric ceramic and the length of the rear cover on the heating rate are smallest.
机译:引入换能器的不同结构参数组合和摩擦加热和塑化聚合物在纵向振动激发下颗粒的相互作用机制,以研究聚合物颗粒的超声塑化,具有已知谐振频率的超声换能器的结构参数和粒子输出幅度在工具头处,利用前端在纵向振动激发下建立聚合物颗粒的摩擦塑化加热方程。通过使用Mathematica软件获得换能器的结构参数与聚合物颗粒的加热速率之间的主导影响,进一步回归分析结果表明,喇叭的放大比对摩擦加热速率的影响最大在纵向振动换能器的结构参数中,前盖长度的效果,超声波工具头长度和喇叭长度在加热速率上较小,压电陶瓷厚度和后盖的长度的影响较小加热速度最小。

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  • 来源
    《Microsystem technologies》 |2018年第9期|共8页
  • 作者单位

    Zhengzhou Univ Sch Mech Engn Sci Ave 100 Zhengzhou 450001 Henan Peoples R China;

    Zhengzhou Univ Sch Mech Engn Sci Ave 100 Zhengzhou 450001 Henan Peoples R China;

    Zhengzhou Univ Sch Mech Engn Sci Ave 100 Zhengzhou 450001 Henan Peoples R China;

    Zhengzhou Univ Sch Mech Engn Sci Ave 100 Zhengzhou 450001 Henan Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路(IC);
  • 关键词

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