Design, simulation and fabrication of LTCC-based microhotplate for gas sensor applications

摘要

This paper presents the design, simulation and fabrication of LTCC-based isothermally interconnected microhotplate. A thermal electric finite element analysis is used to examine the electro-thermo-mechanical behaviour of microhotplate. The heating element is platinum having resistivity 100 m Omega/sq and LTCC is the base substrate. The simulation has been performed for different thicknesses of LTCC substrate. The fabrication has been carried out for 0.711 mm thick LTCC substrate. The comparison between simulation results and characteristics of fabricated microhotplate on 0.711 mm thick LTCC substrate has been made. The variation in temperature of simulated and fabricated microhotplates has been analyzed with respect to the applied voltages.