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Simulation study of gated nanowire InAs/Si Hetero p channel TFET and effects of interface trap

机译:门控纳米线INAS / Si heteroP通道TFET的仿真研究及界面陷阱的影响

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摘要

The impact of EOT (Equivalent Oxide Thickness) scaling, diameter scaling, and interface traps on the performance of gated InAs/Si Hetero pTFET (Tunneling field effect transistor) is investigated. EOT scaling improves SS (SubthresholdSwing) below the thermal limit and on current moderately. Diameter scaling decreases on current and marginally improves SS. The simulation study validates that the transfer characteristics of pTFET in sub-threshold region are completely dominated by thermionic emission of holes and TAT (Trap Assisted Tunneling). This in turn blocks SS to attain < 60 mV/dec. Furthermore, Si/Oxide interface traps minimize the electrostatic gate coupling with channel region additionally deteriorates SS. Interface trap density with different values denotes that sub 2.3k(B)T/q SS can only be realized for interface trap densities D-it < 1 x 10(11) cm(-2)eV(-1) at both InAs/Si and Si/Oxide. Hence this reaffirms the experimental data, that the prerequisite of D-it < 1 x 10(12) cm(-2)eV(-1) for InAs/Si nanowire p-TFET.
机译:研究了EOT(等同氧化物厚度)缩放,直径缩放和接口陷阱对所浇口INAS / SI杂PTFET(隧道场效应晶体管)的性能的影响。 EOT缩放改善了下面的热限制和中等电流的SS(亚阈值)。电流直径缩放减少,并略有改善SS。仿真研究验证了亚阈值区域中PTFET的传递特性完全由孔和TAT的热离子排放(陷阱辅助隧道)。这反过来块SS可以获得<60 MV / DEC。此外,Si /氧化物界面阱最小化与沟道区的静电栅极联接另外劣化SS。具有不同值的接口陷阱密度表示Sub 2.3k(b)T / Q SS只能实现INAS / Si和Si /氧化物。因此,这重新核实实验数据,即INAS / Si纳米线P-TFET的D-IT <1×10(12)厘米(-2)EV(-1)的先决条件。

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