USE OF A LASER DISC FOR CUTTING SILICON WAFERS

摘要

Research studies in the photovoltaic field aim to reduce the costs of electrical energy with the use of photovoltaic cells to the level competitive with the costs of energy produced from conventional energy sources. It is necessary to eliminate the technological process with expensive and difficult-to-automate operations and replace it with a cheap one, whose production can be automated to obtain the above objective. Laser processing has become the key technology for the industrial production of crystalline solar cells. Lasers are mainly used in photovoltaics for cutting wafers or silicon films, glass panels and thin-film modules. The article presents the preliminary understanding of the influence of laser cutting on the quality of silicon-wafer cut edges to ensure their minimum deformation. This paper presents an application of lasers in photovoltaics, mainly including laser-cutting issues, analyzed to improve the quality of the edges of silicon wafers cut with a laser disk rarely used for such a purpose.