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首页> 外文期刊>International Journal of Mechanical Sciences >Crack growth behavior, fracture mechanism, and microstructural evolution of G115 steel under creep-fatigue loading conditions
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Crack growth behavior, fracture mechanism, and microstructural evolution of G115 steel under creep-fatigue loading conditions

机译:蠕变疲劳负载条件下G115钢的裂纹生长行为,断裂机制和微观结构演化

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Creep-fatigue crack growth (CFCG) behavior, fracture mechanism, and microstructural evolution of G115 steel under different hold times and initial stress intensity factor ranges (Delta K-in) were investigated. The crack propagation durations increased significantly with decreasing Delta K-in and increasing dwell time. In da/dN vs. Delta K plots, a "hook" was formed, and it entered the fast crack growth zone at approximately Delta K = 36 MPa root m, which corresponds to sigma(ref) = sigma(0.2) under plane stress. In (da/dt)(avg) vs. (C-t)(avg )plots, data for a specific hold time in a wide load range exhibited a unique relationship. It appears that the parameter D-0 in this relationship is affected by hold time and constraint, while phi is independent of these factors. Scanning electron microscopy analyses revealed that with increasing hold time (60-600 s), the fracture mode changed from transgranular-dominated to intergranular-dominated. Meanwhile, the fracture mode changed from intergranular-dominated to predominantly transgranular with high ductility when Delta K-in increased (17-29 MPa root m). According to electron backscatter diffraction observations, many substructured and recrystallized grains formed after CFCG and the deformed grains further decreased as Delta K-in increased. The increased crack resistance with decreased deformation grains may combine with the ductility fracture effect to decrease the CFCG rates under high load levels. Additionally, the local misorientation angle reduced significantly after CFCG, and the differences among various load levels were limited.
机译:研究了在不同保持时间和初始应力强度因子范围(Delta K-In)下G115钢的蠕变 - 疲劳裂纹生长(CFCG)行为(CFCG)行为,断裂机制和微观结构演化。裂缝繁殖持续时间随着ΔK进入和增加停留时间而显着增加。在DA / DN与ΔK图中,形成“钩”,并且它在大约ΔK= 36MPa根部M处进入快速裂纹生长区,这对应于平面应力下的Sigma(REF)= Sigma(0.2) 。在(da / dt)(avg)与(c-t)(avg)图中,在宽负载范围内的特定保持时间的数据表现出独特的关系。看来,这种关系中的参数D-0受到保持时间和约束的影响,而PHI与这些因素无关。扫描电子显微镜分析显示,随着保持时间的增加(60-600秒),断裂模式从跨血管主导地位变为晶间主导。同时,当Delta k-in增加(17-29MPa根部M)时,断裂模式从晶间占主导地位变为主要的延展性高延展性。根据电子反向散射观察,在CFCG和变形晶粒后形成的许多子结构和再结晶晶粒进一步降低,随着Delta k-in增加。随着变形晶粒减小的增加的抗裂性可以与延展性裂缝效应结合,以降低高负荷水平下的CFCG速率。另外,在CFCG之后,局部错位角度显着降低,各种负载水平之间的差异有限。

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