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Influence of Mold Temperature on Melt Filling Process of a Thin Plate Part with Microstructures in Injection Molding

机译:模具温度对注射成型微结构薄板零件熔体填充过程的影响

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摘要

Mold temperature is one of the most important factors that affect the product qualities in injection molding process. This paper numerically investigated the filling process of a microstructured thin plate with different mold temperatures. The governing equations for the filling process were discretized and solved using finite volume method. The pressure implicit splitting of operations solution algorithm was used to solve the pressure-velocity coupled Navier-Stokes equation for melt filling process. The moving interface between melt and air was captured by using the volume of fluid method. The numerical results show that increasing mold temperature can increase the melt temperature and improve its distribution uniformity in melt filling process. The freezing layer thickness decreases and the melt fluidity are significantly improved as the mold temperature increases. As a result, the replication ability of the surface structures can be enhanced. The freezing layer is completely eliminated and the surface microstructures can be precisely replicated, when mold temperature reaches the polymer-softening temperature.
机译:模具温度是影响注塑成型过程中产品质量的最重要因素之一。本文数值研究了不同模具温度的微结构薄板的填充过程。使用有限体积法离散化和求解了填充过程的控制方程。运用压力隐式分裂解法求解熔体填充过程中的压力-速度耦合Navier-Stokes方程。熔体与空气之间的运动界面是通过流体体积法捕获的。数值结果表明,提高模具温度可以提高熔体温度,改善熔体填充过程中的分布均匀性。随着模具温度的升高,冻结层的厚度减小,熔体流动性显着提高。结果,可以增强表面结构的复制能力。当模具温度达到聚合物软化温度时,将完全消除冻结层,并精确复制表面微观结构。

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