HENKEL HONORED WITH FIVE AWARDS AT APEX

摘要

Henkel Corp., Irvine, CA, was honored with five awards at the IPC APEX EXPO held March 31 -April 2 at the Mandalay Bay Resort and Convention Center in Las Vegas. Two Henkel electronics assembly materials - Hysol~R UF3800~(TM) CSP/BGA underfill and Multicore~R LF700~(TM) lead-free, halide-free solder paste - emerged as winners in their respective categories in several awards contests.