Physics-of-Failure Based Approach for Predicting Life and Reliability of Electronics Components

摘要

Enhancing functional performance while at the same time continuing with the miniaturization of electronic systems are the main drivers for electronic industries world over. The phenomenal growth of VLSIs and embedded systems is testimony to these developments. Development of complex embedded systems using components like FPGA, CPLD, etc, where not only the transistor densities but current densities of interconnects have almost been optimized to the limits, pose reliability issues that need to be addressed. Even though the material properties, design and construction features are better understood than ever before, further research is required to understand root causes of failure so that failure in the field conditions can be further minimized. The traditional method of reliability prediction, Like MIL-217 approach, have some inherent limitations which include, a) it does not allow simulations with projected component load profiles, b) no provisions to assess the root cause(s) of component failure, c) basis and science behind the considerations of base failure rate and other modifying factors are not clear.