Panacol has developed a new epoxy-based underfiller. Structalit 8202 is a classic underfill material designed for chip stack packages and ball grid arrays (BGA). It is a one-part, black-coloured epoxy with low viscosity which flows even into the narrowest gaps. According to Panacol, the special features of this product are its low coefficient of thermal expansion and high glass transition temperature. This makes Structalit 8202 stable at high temperatures, allowing it to be used in reflow processes, the company says.
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