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首页> 外文期刊>材料 >Estimation of Strength Reliability for Ceramic/Metal Jointing Structure -The Basic Study of Thermal Stress and Residual Stress Behavior during Ceramic/Metal Joint process
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Estimation of Strength Reliability for Ceramic/Metal Jointing Structure -The Basic Study of Thermal Stress and Residual Stress Behavior during Ceramic/Metal Joint process

机译:陶瓷/金属连接结构的强度可靠性估算 - 陶瓷/金属接头过程中热应力和残余应力行为的基本研究

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摘要

A simple analysis method was developed bymaking well use of finite element method (FEM) program forgeneral purposes. The temperature dependence of mechanicalproperties for every material consisting of ceramic/metaljointing was considered in this method. Using this method, theresidual stresses producing during the jointing process wereanalyzed for Si_3N_4/SUS304 joints with the insert layer of Cumade by an active metal brazing (Ti-Ag-Cu) method so as toclarify the residual stress behavior due to the creep of Cu. Theequivalent normal stress calculated from the multi-axial stresseswas used to evaluate the strength of fracture which resulted frominitial flaws existing in the ceramic side. From the analyticalresults, it is found that the temperature at which the residualstress begins to generate is about 550 deg C, and it is clarifiedthat the creep of Cu layer during cooling process may relax theresidual stress in ceramics side and can not be neglected for theestimation of ceramic fracture due to residual stress.
机译:通过良好使用有限元方法(FEM)程序以逐一代目的造成简单的分析方法。在该方法中考虑了由陶瓷/金属共用组成的每种材料的机械效率的温度依赖性。使用该方法,在连接过程中产生的存在性应力与Si_3N_4 / SUS304接头的连接过程中,通过活性金属钎焊(Ti-Ag-Cu)方法与插入克切片的插入层,以免由于Cu的蠕变而产生残余应力行为。由多轴应力计算的必需的正常应力,用于评估陶瓷侧存在的骨折强度的裂缝强度。从分析结果来看,发现残留颗粒开始产生的温度约为550℃,并且澄清了冷却过程中Cu层的蠕变可以放松陶瓷侧的情况,并且不能忽略默认陶瓷骨折引起的残余应力。

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