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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of interfacial microstructure on the thermal-mechanical properties of mesophase pitch-based carbon fiber reinforced aluminum composites
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Effect of interfacial microstructure on the thermal-mechanical properties of mesophase pitch-based carbon fiber reinforced aluminum composites

机译:界面微观结构对中间相沥青基碳纤维增强铝复合材料热力学性能的影响

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摘要

Four unidirectional carbon fiber (67.9%-70.0% volume fraction) reinforced aluminum composites (P1001/1199, P100/6063, P120/1199, and P120/6063) were fabricated by pressure infiltration and thermomechanical properties of these composites were investigated. We found interfacial microstructures, especially free of carbide, precipitations and interfacial gaps, are important for the properties of the composites. With proper addition of Mg and Si element, P100/6063 composite possessed moderate interface. Thus, thermal conductivity (TC), bending strength and elastic modulus of that were improved prominently. TC along fiber direction of P100/6063 was (391+1)W/mK, which was close to 95% of the role of mixtures (ROM) model. The coefficient of thermal expansion values (CTE) along fiber direction of all the specimens varied between -1 x 10(-6)/K and 1 x 10(-6)/K. The bending strength and the elastic modulus of P100/6063 composite exhibited a 31.6% and 14.3% increase respectively in comparison to those of P100/1199 composite. High TC, low CTE value, and excellent mechanical properties make this material promising for microelectronic chips production. (C) 2018 Elsevier B.V. All rights reserved.
机译:通过压力渗透制造了四种单向碳纤维(67.9%-70.0%体积分数)增强铝复合材料(P1001 / 1199,P100 / 6063,P120 / 1199和P120 / 6063),并研究了这些复合材料的热机械性能。我们发现界面微观结构,特别是没有碳化物,沉淀和界面间隙,对复合材料的性质很重要。采用适当加入Mg和Si元素,P100 / 6063复合材料具有中等界面。因此,导热性(Tc),抗弯曲强度和弹性模量突出。沿P100 / 6063的纤维方向的Tc是(391 + 1)w / mk,接近混合物(ROM)模型的作用的95%。沿所有样品的纤维方向的热膨胀值(CTE)系数在-1×10(-6)/ k和1×10(-6)/ k之间变化。与P100 / 1199复合材料相比,P100 / 6063复合材料的弯曲强度和弹性模量分别表现出31.6%和14.3%。高TC,低CTE值和优异的机械性能使得这种材料对微电子芯片产生有前途。 (c)2018年elestvier b.v.保留所有权利。

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