首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of sintering temperature on the mechanical properties and microstructures of pressureless-sintered B4C/SiC ceramic composite with carbon additive
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Effect of sintering temperature on the mechanical properties and microstructures of pressureless-sintered B4C/SiC ceramic composite with carbon additive

机译:烧结温度对碳添加剂无压烧结B4C / SiC陶瓷复合材料的力学性能和微观结构的影响

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B4C/SiC (15 wt%) ceramic composite with 2 wt% carbon additive was fabricated via solid-phase pressureless sintering under an argon atmosphere for 60 min between 2100 degrees C and 2200 degrees C. The effects of the sintering temperature on the microstructure and mechanical properties of the B4C/SiC ceramic composites were studied in detail. The optimum values of the relative density, Vickers hardness, flexural strength, and fracture toughness of the B4C/SiC ceramic composite sintered at 2150 degrees C were 95.3%, 25.5 GPa, 296 MPa, and 2.81 MPa m(1/2), respectively. The microstructural investigations revealed that when the sintering temperature increases from 2100 degrees C to 2150 degrees C, sintered necks begin to grow and the densification zone increases. With sintering temperatures above 2150 degrees C, the grains grow rapidly such that the pores are not eliminated, causing the formation of large closed pores and resulting in a decrease in the relative density and mechanical properties of the B4C/SiC ceramic composite. The plate-like and irregular SiC grains are uniformly dispersed in the B4C matrix to inhibit B4C grain growth. The interface between SiC and B4C is clean and narrow, and the clean boundary suggests strong binding, which contributes to the mechanical properties of the B4C/SiC ceramic composite. At 2150 degrees C, the C additive undergoes significant crystallisation, forming lamellar structures with high aspect ratios, thereby promoting the pores in the ceramic composite to be discharged to the outside through volume diffusion to obtain a denser sintered body. The interface between B4C and graphite is a semi-coherent interface that increases the flexural strength with a low defect concentration. The main toughening mechanisms of the B4C/SiC ceramic composite are crack deflection and crack branching around the SiC grains and crack bridging by SiC grains in the wake of the crack tip. (C) 2019 Elsevier B.V. All rights reserved.
机译:通过固相压力烧结在氩气氛下通过固相压力烧结制造具有2wt%碳添加剂的B4C / SiC(15wt%)陶瓷复合材料在2100℃和2200℃之间进行60分钟。烧结温度对微观结构的影响和详细研究了B4C / SiC陶瓷复合材料的机械性能。在2150℃下烧结的B4C / SiC陶瓷复合材料的相对密度,维氏硬度,弯曲强度和断裂韧性的最佳值分别为95.3%,25.5GPa,296MPa和2.81MPa m(1/2) 。微观结构研究表明,当烧结温度从2100℃升高到2150℃时,烧结颈部开始生长并且致密化区增加。随着烧结温度高于2150℃,晶粒迅速生长,使得孔未被消除,导致形成大的闭孔,并导致B4C / SiC陶瓷复合材料的相对密度和机械性能降低。板状和不规则的SiC晶粒均匀地分散在B4C基质中以抑制B4C晶粒生长。 SiC和B4C之间的界面是干净且窄的,并且清洁边界表明强烈的结合,这有助于B4C / SiC陶瓷复合材料的机械性能。在2150℃下,C添加剂经历显着的结晶,形成具有高纵横比的层状结构,从而促进陶瓷复合物中的孔以通过体积扩散排出到外部,以获得更密集的烧结体。 B4C和石墨之间的界面是半相干界面,其提高具有低缺陷浓度的弯曲强度。 B4C / SiC陶瓷复合材料的主要增韧机构是SiC晶粒周围的裂纹偏转和裂缝支化,并通过SiC颗粒在裂缝尖端的晶粒周围桥接。 (c)2019 Elsevier B.v.保留所有权利。

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