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Improvement of interfacial bonding between plasma-sprayed cast iron splat and aluminum substrate through preheating substrate

机译:通过预热基材改善等离子体喷涂铸铁Splat和铝基板之间的界面键合

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摘要

During the plasma spraying process, the splat-substrate interaction is a key factor to understanding the formation of the coating-substrate adhesion. In the present study, both experimental and simulation methods were employed to analyse the splat-substrate interfacial bond and its formation. Individual cast iron splats were sprayed onto polished aluminum substrate surfaces, which were preheated to temperatures ranging from 25 degrees C to 240 degrees C. After spraying, polished cross sections of the collected splats were examined by scanning electron microscopy to identify the splat-substrate interface bonding characteristics. Furthermore, numerical simulation was conducted using a finite element method (FEM) to obtain quantitative information on heat exchange between the splat and the substrate. Results showed that the substrate preheating temperature (initial substrate temperature) significantly affected the splat-substrate bond formation. When the initial substrate temperature exceeded 190 degrees C, the formation of a metallurgical bond at the splat-substrate interface was detected. The results of the analysis based on both experimental and simulation data, demonstrated that the higher initial substrate temperature caused obvious plastic deformation of the substrate surface and atomic diffusion at the splat-substrate interface under the present conditions, which contributed to the formation of the metallurgical bond. Moreover, a barb-shaped structure was found at the periphery of the splat when the initial substrate temperature reached 240 degrees C, which was beneficial to the enhancement of the mechanical bonding between the splat and the substrate. (C) 2017 Elsevier B.V. All rights reserved.
机译:在等离子体喷涂工艺期间,Splat衬底相互作用是理解涂层基板粘附的形成的关键因素。在本研究中,使用实验和模拟方法来分析Splat底物界面键及其形成。将个体铸铁Splats喷涂到抛光的铝基板表面上,将其预热至从25℃至240℃的温度。通过扫描电子显微镜检查收集的Splats的抛光横截面以识别夹持基板界面粘接特征。此外,使用有限元法(FEM)进行数值模拟,以获得关于SPLAT和衬底之间的热交换的定量信息。结果表明,基板预热温度(初始衬底温度)显着影响了夹持基材键合形成。当初始衬底温度超过190℃时,检测在分裂衬底接口处形成冶金键。基于两种实验和仿真数据的分析结果证明,在本条件下,较高初始衬底温度导致衬底表面和原子扩散在本条件下的衬底表面的明显变形,这有助于形成冶金的形成键。此外,当初始基板温度达到240℃时,在夹持的周边处发现倒钩形状,这有利于平均和基板之间的机械键合的增强。 (c)2017年Elsevier B.V.保留所有权利。

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