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首页> 外文期刊>RSC Advances >Optimization of makerspace microfabrication techniques and materials for the realization of planar, 3D printed microelectrode arrays in under four days
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Optimization of makerspace microfabrication techniques and materials for the realization of planar, 3D printed microelectrode arrays in under four days

机译:用于实现平面的Makerspace微型制造技术和材料的优化,3D印刷微电极阵列在四天内

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摘要

Conventional two-dimensional microelectrode arrays (2D MEAs) in the market involve long manufacturing timeframes, have cleanroom requirements, and need to be assembled from multiple parts to obtain the final packaged device. For MEAs to be used and tossed, manufacturing has to be moved from the cleanroom to makerspaces. In order to enable makerspace fabricated MEAs comparable to conventional MEAs, the microfabrication processes must be optimized to have similar electrical properties along with biocompatibility and number of recording sites. This work presents a makerspace microfabricated 2D MEA having electrode densities up to a commercially popular 8 x 8 array, all fabricated under four days. Additive manufacturing-based realization of the MEA devices provides immense flexibility in terms of meeting distinct design requirements. A unique non-planar MEA having meso-scale electrodes on the top side of a chip transitioning to traces onto the bottom side through electrical vias is presented in this work. This allows for (a) monolithic integration of a culture well for devices having up to a 6 x 6 MEA array, (b) selective electroplating of the meso-scale electrodes (500 m diameter) defined by silver ink casting followed by pulsed electroplating of gold or platinum without any masking procedure, (c) casting of a uniform and planar insulation layer via a novel process of confined precision spin coating (CPSC) of SU-8 which acts as a biocompatible insulation atop the meso-scale electrodes; and (d) selective laser micromachining to define the 50 m x 50 m microelectrodes. For an 8 x 8 array, the culture well and MEA chip framework are 3D printed as two separate parts and sealed together with a biocompatible epoxy as in commercially available MEAs. The fabricated MEAs have an average 1 kHz impedance of 36.8 k/16 k with a double layer capacitance of 400 nF cm(-2)/520 nF cm(-2) for nano-porous platinum/nano-gold which is comparable to the state-of-art commercially available 2D MEAs. Additionally, it was found out that our 3D printing-based process compares very favorably with traditional glass MEAs in terms of design to device while representing a dramatic reduction in cost, timeline for fabrication, reduction in the number of steps and the need for sophisticated microfabrication and packaging equipment.
机译:市场中的传统二维微电极阵列(2D MEAS)涉及长的制造时间框架,具有洁净室的要求,需要从多个部件组装以获得最终封装设备。对于使用和折腾的测量,必须从洁净室移动到制造空间。为了使Makerspace能够制造与传统测量的比较,必须优化微型加工过程,以具有类似的电性能以及生物相容性和记录部位的数量。这项工作介绍了一个Makerspace微制造的2D MEA,其具有电极密度,高于商业普遍的8×8阵列,全部由四天制造。基于加性制造的MEA器件的实现在满足明显的设计要求方面提供了巨大的灵活性。在这项工作中,提出了一种独特的非平面MEA,其顶侧上的芯片的顶侧转换到底部底部的窗口。这允许(a)用于具有高达6×6 Mea阵列的装置的培养物的单片整合,(b)由银色墨水铸件限定的中间尺度电极(直径500m直径)的选择性电镀,然后脉冲电镀金或铂没有任何掩蔽程序,(c)通过SU-8的狭窄精密旋涂(CPSC)的新方法铸造均匀和平面绝缘层,其用作在中间尺度电极上的生物相容性绝缘; (D)选择性激光微机械线以定义50米×50米的微电极。对于8×8阵列,培养井和MEA芯片框架是3D印刷为两个独立的部件,并与生物相容的环氧树脂一起密封,如在市售的MEA中。制造的MES具有平均1kHz阻抗为36.8 k / 16 k,双层电容为400nf cm(-2)/ 520 nf cm(-2),用于纳米多孔铂/纳米金,其与该纳米多孔铂/纳米金相当最先进的商用2D MEA。此外,发现我们的3D印刷过程非常有利地与传统的玻璃测量在设计方面非常有利,同时代表成本,制造时间表的显着减少,减少步骤的数量以及对复杂微生物的需要以及需要​​复杂的微制造和包装设备。

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  • 来源
    《RSC Advances》 |2019年第16期|共15页
  • 作者单位

    Univ Cent Florida NanoSci Technol Ctr NSTC Res 1 Off 237 4353 Scorpius St Orlando FL 32816 USA;

    Univ Miami Dept Elect &

    Comp Engn Coral Gables FL 33146 USA;

    Univ Cent Florida NanoSci Technol Ctr NSTC Res 1 Off 237 4353 Scorpius St Orlando FL 32816 USA;

    Univ Cent Florida NanoSci Technol Ctr NSTC Res 1 Off 237 4353 Scorpius St Orlando FL 32816 USA;

    Univ Cent Florida NanoSci Technol Ctr NSTC Res 1 Off 237 4353 Scorpius St Orlando FL 32816 USA;

    Univ Cent Florida NanoSci Technol Ctr NSTC Res 1 Off 237 4353 Scorpius St Orlando FL 32816 USA;

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  • 正文语种 eng
  • 中图分类 化学;
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