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Thin Al_2O_3 barrier coatings onto temperature-sensitive packaging materials by atomic layer deposition

机译:通过原子层沉积在温度敏感的包装材料上形成薄的Al_2O_3阻隔涂层

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摘要

Thin (25nm) and highly uniform Al_2O_3 coatings have been deposited at relatively low temperature of 80 and 100°C onto various bio-based polymeric materials employing the atomic layer deposition (ALD) technique. The work demonstrates that the ALD-grown Al_2O_3 coating significantly enhances the oxygen and water vapor barrier performance of these materials. Promising barrier properties were revealed for polylactide-coated board, hemicellulose-coated board as well as various biopolymer (polylactide, pectin and nano-fibrillated cellulose) films.
机译:薄(25nm)和高度均匀的Al_2O_3涂层已在80和100°C的较低温度下使用原子层沉积(ALD)技术沉积到各种生物基聚合物材料上。这项工作表明,ALD生长的Al_2O_3涂层显着增强了这些材料的氧气和水蒸气阻隔性能。聚乳酸涂层板,半纤维素涂层板以及各种生物聚合物(聚丙交酯,果胶和纳米原纤化纤维素)薄膜的阻隔性能都很好。

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